Tài liệu .Committee on Manufacturing Trends in Printed Circuit Technology Board on Manufacturing and

Committee on Manufacturing Trends in Printed Circuit Technology

Board on Manufacturing and Engineering Design

Division on Engineering and Physical Sciences

THE NATIONAL ACADEMIES PRESS 500 Fifth Street, N.W. Washington, DC 20001

NOTICE: The project that is the subject of this report was approved by the Governing Board of the

National Research Council, whose members are drawn from the councils of the National Academy of

Sciences, the National Academy of Engineering, and the Institute of Medicine. The members of the

committee responsible for the report were chosen for their special competences and with regard for

appropriate balance.

This study was supported by Contract No. N00014-00-G-0230 between the National Academy of

Sciences and the Department of Defense. Any opinions, findings, conclusions, or recommendations

expressed in this publication are those of the authors and do not necessarily reflect the views of the

organizations or agencies that provided support for the project.

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Copyright 2005 by the National Academy of Sciences. All rights reserved.

Printed in the United States of America

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chair, respectively, of the National Research Council.

www.national-academies.org

iv

COMMITTEE ON MANUFACTURING TRENDS IN PRINTED CIRCUIT TECHNOLOGY

DAVID J. BERTEAU, Chair, Clark and Weinstock

KATHARINE G. FRASE, IBM Microelectronics

CHARLES R. HENRY, U.S. Department of Defense (retired)

JOSEPH LaDOU, University of California, San Francisco

KATHY NARGI-TOTH, Technic, Inc.

ANGELO M. NINIVAGGI, JR., Plexus Corporation

MICHAEL G. PECHT, University of Maryland

E. JENNINGS TAYLOR, Faraday Technology, Inc.

RICHARD H. VAN ATTA, Institute for Defense Analyses

ALFONSO VELOSA III, Gartner, Inc.

DENNIS F. WILKIE, Compass Group, Ltd.

Staff

TONI MARECHAUX, Study Director

MARTA VORNBROCK, Research Assistant

LAURA TOTH, Senior Program Assistant

v

BOARD ON MANUFACTURING AND ENGINEERING DESIGN

PAMELA A. DREW, Chair, The Boeing Company

CAROL L.J. ADKINS, Sandia National Laboratories

GREGORY AUNER, Wayne State University

RON BLACKWELL, AFL-CIO

THOMAS W. EAGAR, Massachusetts Institute of Technology

ROBERT E. FONTANA, JR., Hitachi Global Storage Technologies

PAUL B. GERMERAAD, Intellectual Assets, Inc.

TOM HARTWICK, Adviser, Snohomish, Washington

ROBERT M. HATHAWAY, Oshkosh Truck Corporation

PRADEEP K. KHOSLA, Carnegie Mellon University

JAY LEE, University of Wisconsin, Milwaukee

DIANA L. LONG, Consultant, Charleston, West Virginia

MANISH MEHTA, National Center for Manufacturing Sciences

NABIL Z. NASR, Rochester Institute of Technology

ANGELO M. NINIVAGGI, JR., Plexus Corporation

JAMES B. O'DWYER, PPG Industries

HERSCHEL H. REESE, Dow Corning Corporation

H.M. REININGA, Rockwell Collins, Inc.

LAWRENCE J. RHOADES, Ex One Corporation

JAMES B. RICE, JR., Massachusetts Institute of Technology

DENISE F. SWINK, Adviser, Germantown, Maryland

ALFONSO VELOSA III, Gartner, Inc.

BEVLEE A. WATFORD, Virginia Polytechnic University

JACK WHITE, Altarum

Staff

TONI MARECHAUX, Director

vii

Preface

Today's defense systems incorporate an increasing number of electronic components, intended to

enable these systems to be more accurate, more sophisticated, and more effective. Advances in printed

circuits and associated interconnection—an integral technology—have enabled this trend, and these

advances are expected to continue to enable future combat systems.

To examine a number of issues surrounding the manufacturing and supply of these components,

the National Research Council convened a panel of experts—the Committee on Manufacturing Trends in

Printed Circuit Technology—to examine trends in electronics interconnection technology and

manufacturing and their effect on U.S. defense needs.

The charge to the committee was specifically to do the following:

• Examine worldwide and U.S. trends in technology investment and manufacturing competences

for printed circuit boards.

• Assess the role of printed circuit boards in maintaining U.S. military capability, especially in

meeting unique defense needs.

• Examine current laws, policies, and regulations that pertain to printed circuit board

manufacturing and their impact on maintaining future military capability.

• Describe potential strategies for research, development, and manufacturing for printed circuit

boards to meet both legacy and future U.S. defense needs.

A meeting was held December 13 and 14, 2004, attended by committee members, expert

consultants, and Department of Defense (DoD) representatives. Technical topics were presented and

discussed covering the general areas of system considerations, the suitability of current supply practices,

the influence of new technologies, and technology insertion. DoD representatives provided a useful

overview and rationale to set the stage for the discussions. Formal presentations were brief in order to

allow for significant interactions between committee members and guests to home in on responses to the

tasks listed above. After the meeting, the committee continued to gather information and to discuss and

deliberate on findings, conclusions, and recommendations.

This report has been reviewed in draft form by individuals chosen for their diverse perspectives and

technical expertise, in accordance with procedures approved by the National Research Council's Report

Review Committee. The purpose of this independent review is to provide candid and critical comments

that will assist the institution in making its published report as sound as possible and to ensure that the

report meets institutional standards for objectivity, evidence, and responsiveness to the study charge.

The review comments and draft manuscript remain confidential to protect the integrity of the deliberative

process. We wish to thank the following individuals for their review of this report: Doug Freitag, Bayside

Materials Technology; Steven P. Gootee, SAIC; Carol Handwerker, Purdue University; R. Wayne

Johnson, Auburn University; Paul G. Kaminski, Technovation, Inc.; Robert Pfahl, iNEMI; Joe Schmidt,

Raytheon; and Frank Talke, University of California, San Diego.

viii PREFACE

Although the reviewers listed above have provided many constructive comments and suggestions,

they were not asked to endorse the conclusions or recommendations, nor did they see the final draft of

the report before its release. The review of this report was overseen by Elsa Garmire, Dartmouth

College. Appointed by the National Research Council, she was responsible for making certain that an

independent examination of this report was carried out in accordance with institutional procedures and

that all review comments were carefully considered. Responsibility for the final content of this report rests

entirely with the authoring committee and the institution.

The committee also acknowledges the speakers from government and industry who took the time

to share their ideas and experiences. H.M. Reininga, Board on Manufacturing and Engineering Design

liaison to the committee, also greatly assisted the work of the committee through his participation in many

of the committee's activities. Finally, the committee acknowledges the contributions to the completion of

this report from the staff of the National Research Council, including Marta Vornbrock, Laura Toth, and

Toni Marechaux, as well as those of Albert Alla, an intern at the National Research Council who assisted

in background research for the report.

David J. Berteau, Chair

Committee on Manufacturing Trends in Printed Circuit Technology