Engineering Materials and Processes phần 2 pptx

Introduction 5

1.2 Properties of Silver, Copper and Aluminum

A comparison of the electrical, physical, mechanical, and thermal properties of

silver, copper, and aluminum is given in Table 1.1.

Table 1.1. Comparison of properties of Ag with Cu and Al

Properties Ag Cu Al

Bulk resistivity

(μΩ-cm) at 20 °C

1.59 1.68 2.65

Thin film resistivity

(μΩ-cm) at 20 °C

2.0 (Ag/Ti) 2.0–2.5 (Cu/Cr)

2.8 (Cu/Ni)

3.3 (Al-Cu)

Diffusivity in Si

(cm2

/sec)

2.3×10–3 e

–1.6/kT 4.2×10–2 e–1.0/kT –

Self-diffusivity

(cm2

/sec)

0.67e–1.97/kT 0.78 e–2.19/kT 1.71 e–1.48/kT

Electromigration

activation energy

(eV)

0.95

(225–285 °C)

1.1

(250–395 °C)

0.4–0.8

Young’s modulus

(×1011 dyn cm–2)

8.27 12.98 7.06

TCR×103 (K–1) 4.1 4.3 4.0

Mean free path of e–

(nm)

52.0 39.0 15.0

Melting point (°C) 961 1083 917

Thermal

conductivity

(Wcm–1 K–1)

4.25 3.98 2.38