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Simulation Study On A Dual Axis Thermal Convective Gas Gyroscope Based On Corona Discharge Ion Wind
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Simulation Study On A Dual Axis Thermal Convective Gas Gyroscope Based On Corona Discharge Ion Wind

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Mô tả chi tiết

VIETNAM NATIONAL UNIVERSITY, HANOI

UNIVERSITY OF ENGINEERING AND TECHNOLOGY

NGUYEN THU HANG

SIMULATION STUDY ON A DUAL-AXIS THERMAL

CONVECTIVE GAS GYROSCOPE BASED ON CORONA

DISCHARGE ION WIND

Field: Electronics and Telecommunications

Major: Electronic Engineering

Code: 60520203

MASTER THESIS IN

ELECTRONICS AND COMMUNICATIONS

Supervisor: Assoc. Prof. Bui Thanh Tung

HANOI - 2021

VIETNAM NATIONAL UNIVERSITY, HANOI

UNIVERSITY OF ENGINEERING AND TECHNOLOGY

NGUYEN THU HANG

SIMULATION STUDY ON A DUAL-AXIS THERMAL

CONVECTIVE GAS GYROSCOPE BASED ON CORONA

DISCHARGE ION WIND

Field: Electronics and Telecommunications

Major: Electronic Engineering

Code: 60520203

MASTER THESIS IN

ELECTRONICS AND COMMUNICATIONS

Supervisor: Assoc. Prof. Bui Thanh Tung

HANOI - 2021

i

AUTHORSHIP

“I hereby declare that the work entitled “Simulation study on a dual-axis

thermal convective gas gyroscope based on corona discharge ion wind”

contained in this thesis is of my own and has not been previously submitted for a

degree or diploma at this or any other higher education institution. To the best of

my knowledge and belief, the thesis contains no materials previously published or

written by another person except where due reference or acknowledgement is

made.”

Date: May 25, 2021

Signature: ......................................................

ii

ACKNOWLEDGEMENT

First of all, I would like to express my special thanks of gratitude to Assoc. Prof.

Bui Thanh Tung, my beloved research supervisor, for his patient guidance,

enthusiastic encouragement, and valuable support on this project. His passion,

inspiration, insightful recommendations have been helping me overcome the

difficulties that I encountered in all the researching and thesis writing time.

I would also like to extend my sincere thanks to Prof. Chu Duc Trinh, Dr. Dau

Thanh Van, and Ph.D. student Tran Van Ngoc for giving me strength and their

assistance at every stage of the research project.

In addition, I would like to show my appreciation to Micro-Electromechanical and

Microsystems Department (MEMS), and the University of Engineering and

Technology, for giving me a perfect working and researching environment.

Last but not least, I would like to offer my special thanks to my family and my

friends for helping me a lot throughout writing this thesis and my life in general.

May 25, 2021

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