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Simulation Study On A Dual Axis Thermal Convective Gas Gyroscope Based On Corona Discharge Ion Wind
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VIETNAM NATIONAL UNIVERSITY, HANOI
UNIVERSITY OF ENGINEERING AND TECHNOLOGY
NGUYEN THU HANG
SIMULATION STUDY ON A DUAL-AXIS THERMAL
CONVECTIVE GAS GYROSCOPE BASED ON CORONA
DISCHARGE ION WIND
Field: Electronics and Telecommunications
Major: Electronic Engineering
Code: 60520203
MASTER THESIS IN
ELECTRONICS AND COMMUNICATIONS
Supervisor: Assoc. Prof. Bui Thanh Tung
HANOI - 2021
VIETNAM NATIONAL UNIVERSITY, HANOI
UNIVERSITY OF ENGINEERING AND TECHNOLOGY
NGUYEN THU HANG
SIMULATION STUDY ON A DUAL-AXIS THERMAL
CONVECTIVE GAS GYROSCOPE BASED ON CORONA
DISCHARGE ION WIND
Field: Electronics and Telecommunications
Major: Electronic Engineering
Code: 60520203
MASTER THESIS IN
ELECTRONICS AND COMMUNICATIONS
Supervisor: Assoc. Prof. Bui Thanh Tung
HANOI - 2021
i
AUTHORSHIP
“I hereby declare that the work entitled “Simulation study on a dual-axis
thermal convective gas gyroscope based on corona discharge ion wind”
contained in this thesis is of my own and has not been previously submitted for a
degree or diploma at this or any other higher education institution. To the best of
my knowledge and belief, the thesis contains no materials previously published or
written by another person except where due reference or acknowledgement is
made.”
Date: May 25, 2021
Signature: ......................................................
ii
ACKNOWLEDGEMENT
First of all, I would like to express my special thanks of gratitude to Assoc. Prof.
Bui Thanh Tung, my beloved research supervisor, for his patient guidance,
enthusiastic encouragement, and valuable support on this project. His passion,
inspiration, insightful recommendations have been helping me overcome the
difficulties that I encountered in all the researching and thesis writing time.
I would also like to extend my sincere thanks to Prof. Chu Duc Trinh, Dr. Dau
Thanh Van, and Ph.D. student Tran Van Ngoc for giving me strength and their
assistance at every stage of the research project.
In addition, I would like to show my appreciation to Micro-Electromechanical and
Microsystems Department (MEMS), and the University of Engineering and
Technology, for giving me a perfect working and researching environment.
Last but not least, I would like to offer my special thanks to my family and my
friends for helping me a lot throughout writing this thesis and my life in general.
May 25, 2021