Fundamentals of Electronic systems design

Jens Lienig

Hans Bruemmer

Fundamentals

of Electronic

Systems Design

Fundamentals of Electronic Systems Design

Jens Lienig • Hans Bruemmer

Fundamentals of Electronic

Systems Design

123

Jens Lienig

Electrical and Computer Engineering

Dresden University of Technology

Dresden, Sachsen

Germany

Hans Bruemmer

Springe, Niedersachsen

Germany

ISBN 978-3-319-55839-4 ISBN 978-3-319-55840-0 (eBook)

DOI 10.1007/978-3-319-55840-0

Library of Congress Control Number: 2017935558

© Springer International Publishing AG 2017

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Foreword

It is hard to underestimate the impact that electronic systems have on society.

My first portable radio was proudly marked “7 transistors.” Today, the electronic

system in my pocket has over 2 trillion (2e12) transistors. There are 20 times more

transistors in my smartphone than there are stars in the Milky Way galaxy. This

unprecedented scale is enabled by the exponential self-fulfilling promise of Moore’s

law. For over 50 years, the component integration density has been doubling every

18–24 months, while per-device cost went down at the same rate. In all of history,

no other industrial law has been as reliable, and no other law has been as influential.

Moore’s law has fueled the PC revolution in the 1980s, the Internet in the 1990s,

the social media in the 2000s, the smartphone, and now the machine learning

revolution. New electronic systems extend our senses, helping us see, helping us

navigate, and helping us drive safely. The impact reaches beyond the gadgets:

Electronic systems affect the way everybody works and lives. It is even fueling

political revolutions, for better or for worse….

It is easily overlooked that Moore’s law implies that the human designers of

electronic systems need to improve their productivity at the same exponential rate.

Even a large company like Apple could not afford to double the size of their design

team every two years to keep up with design scale. The A10 chip in the iPhone 7 is

estimated to have 10
the number of components as the A4 chip in the iPhone 4

just five years earlier. The size of the design team, however, remained roughly the

same.

It is no small achievement that electronic systems of this scale can be suc￾cessfully designed, engineered, and mass-produced. This book addresses the

engineering fundamentals behind the design process of effective and reliable

electronic systems. Both students and professionals alike will appreciate the con￾tents: The first because it sets up the fundamentals of the entire design process in

detail, and the latter because the book brings together state-of-the-art design skills

from the extensive experience of the authors.

The first chapters of the book address the architecture and fundamental structure

of the design process of electronic systems. That includes the engineering decisions

on breaking up the design into more manageable partitions. This must be done in a

v

way that makes assembly straightforward and reliable. It must also be done while

taking into account the limitations of tools, physics, regulatory rules, and people.

The main thrust of this book is addressing ways to “tame” the physical effects

and control the unwanted side effects of the large-scale integration. The objective is

to make the system reliable in production and use, and to make it resilient against

external influences. The authors lay down thorough in-depth description of the

theory and practice of reliability engineering. After all, it is only as strong as the

weakest link.

A significant portion of this book addresses the heat that is dissipated in the

electronic system. This is a point where the steady progression of Moore’s law

poses a true challenge, as the transistor density continues to increase exponentially

while the per-transistor power does not decrease at the same rate. To keep the

device temperature under control, either the heat needs to be avoided or the heat

transfer rate needs to be maximized. The authors present the fundamentals on

assessing and optimizing heat flows of electronic systems.

There have been several occasions where products malfunction because of

electromagnetic interference. To avoid such design errors, this book provides an

excellent description on reducing such unwanted coupling of the system and the

environment. The clear set of guidelines and design recommendations is provided

to ruggedize the electronic system from the start.

Once an afterthought, minimizing the environmental impact of electronic sys￾tems is becoming a major design criterion. There are already billions of electronic

systems surrounding us, most of which have a relatively short life span. At the same

time, the highly compact and integrated nature of electronic systems makes them

harder to open and disassemble. Therefore, even small design improvements matter.

An in-depths guide to addressing all environmental aspects during the full design

cycle is presented by the authors.

This unique book provides fundamental, complete, and indispensable informa￾tion regarding the design of electronic systems. This topic has not been addressed as

complete and thorough anywhere before. Since the authors are world-renown

experts, it is a foundational reference for today’s design professionals, as well as for

the next generation of engineering students.

Dr. Patrick Groeneveld

Scientist

Synopsys Inc., Mountain View, CA, USA

vi Foreword

Preface

If you have an extreme passion for producing great products,

it pushes you to be integrated… It takes a lot of hard work to

make something simple, to truly understand the underlying

challenges and come up with elegant solutions.

Steve Jobs

We are rarely aware, in our daily use of smartphones, notebooks, etc., that the

development of mobile electronic devices started only a few decades ago. After the

discovery of the transistor in 1948, the first integrated circuit was built in 1960,

followed by the microprocessor in 1971. Then in 1973, Motorola developed the first

prototype mobile phone, in 1976, Apple Computer introduced the Apple I, and IBM

introduced the IBM PC in 1981. The popularity in the late 1990s of cell phones and

increasingly powerful laptop computers foreshadowed the iPhones and iPads that

became ubiquitous at the turn of the century. We have truly become a society

immersed in mobile electronic devices.

The packaging density, i.e., the number of components per unit volume, has

increased consistently throughout this period and shows little indication of slowing

down. The resulting amount of heat to be dissipated increased as well, putting the

spotlight on heat transfer issues. It further became obvious that the reliability, i.e.,

the function and durability of electronic components, depends greatly on temper￾ature. Another problem identified was the undesirable influence of switching

functions, caused by unwanted signals inside and outside packages. These issues

came under the heading of electronic systems design, which quickly became an

important interdisciplinary subdiscipline of electrical engineering.

Since the first appearance of mobile electronic devices, such as the transistor

radio in 1954, components have undergone massive development and miniatur￾ization; integrated circuits have reached unheard of complexity levels, and new

packaging methods coupled with computer-aided design (CAD) have revolution￾ized the design of electronic systems. More recently, recycling and environmental

requirements were also added to the mix. It is amazing to realize that every

smartphone today has more computing power than the on-board computer in

vii

Apollo 11, which transported the first humans to another astronomical object back

in 1969.

This book addresses this enormous scientific progress and offers a review of the

current state of the art in the development of electronic systems. It is the result

of the extensive experience of its two authors in industry, academic research, and

teaching in electronic systems design. Its aim is to support the reader with the

development and fabrication of modern electronic devices, taking all relevant

aspects into consideration with a clear presentation of the underlying technical and

scientific principles. The book elucidates a broad range of techniques that have

helped keep German engineering at the cutting edge for several decades and will

continue to do so for decades to come.

A book of such considerable scope can never be accomplished by one indi￾vidual. The authors wish to express their warm appreciation and thanks to all who

helped produce this publication. We would like to mention in particular Martin

Forrestal for his key role in writing the English version of the book. Our warm

thanks go to Dr. Mike Alexander who has greatly assisted in the preparation of the

English text. We also wish to sincerely thank the following for their support with

subsections of the manuscript: Dr. Alfred Kamusella (Sect. 2.6), Dr. Helmut Löbl

(Chap. 5), Prof. Stefan Dickmann and Dr. Ralf Jacobs (Chap. 6), Prof. Karl-Heinz

Gonschorek (Sect. 6.6), Prof. Günter Röhrs (Chap. 7), Steve Bigalke (Appendices

8.1 and 8.2), and Dr. Frank Reifegerste (Appendices 8.4 and 8.5). Thanks are also

due to Nicole Lowary and Charles B. Glaser of Springer for being very supportive

and going beyond their call of duty to help out with our requests.

Rapid progress will continue to be made in electronic systems design in the years

to come, perhaps by some of the readers of this humble book. The authors are

always grateful for any comments or ideas for the future development of the book,

and wish you good luck in your careers.

Dresden, Germany Jens Lienig

Springe, Germany Hans Bruemmer

viii Preface

Contents

1 Introduction.............................................. 1

2 Design Process and Its Fundamentals ......................... 5

2.1 Life Cycle of Electronic Products.......................... 5

2.2 Design and Development Process.......................... 6

2.3 Guidance for Product Planning, Design and Development ....... 8

2.3.1 Planning Development Work....................... 10

2.3.2 Information Flow................................ 10

2.3.3 Feasibility Study During Product Planning ............ 12

2.3.4 Task Definition and Conceptual Stage................ 12

2.3.5 Functional Specification .......................... 14

2.3.6 Scheduling..................................... 15

2.4 Technical Drawings .................................... 17

2.5 Circuit Diagrams ...................................... 22

2.6 Computer-Aided Design (CAD) ........................... 24

References................................................ 29

3 System Architecture and Protection Requirements............... 31

3.1 Introduction—Terminology, Functions and Structures .......... 31

3.1.1 System Characteristics of Devices................... 32

3.1.2 System Environment ............................. 32

3.1.3 System Functions ............................... 33

3.1.4 System Structure ................................ 34

3.2 System Design Architecture .............................. 35

3.2.1 System Granularity .............................. 35

3.2.2 System Assembly ............................... 36

3.2.3 System Integration in Environment .................. 38

3.3 Electronic System Levels ................................ 38

3.4 System Protection ...................................... 39

3.4.1 CE Designation ................................. 40

ix

3.4.2 Protection Classes ............................... 40

3.4.3 IP Codes of Enclosures ........................... 42

References................................................ 43

4 Reliability Analysis ........................................ 45

4.1 Introduction .......................................... 45

4.2 Calculation Principles................................... 47

4.2.1 Probability Terminology .......................... 47

4.2.2 Reliability Terminology........................... 49

4.2.3 Reliability Parameters ............................ 49

4.3 Exponential Distribution ................................. 53

4.3.1 Reliability Distributions........................... 53

4.3.2 Reliability Parameters and the Exponential

Distribution .................................... 55

4.4 Failure of Electronic Components.......................... 56

4.4.1 Drift ......................................... 57

4.4.2 Reference and Operating Conditions ................. 57

4.4.3 Failure Rates of Electronic Components .............. 58

4.4.4 Derating ...................................... 60

4.4.5 Accuracy of Failure Rates......................... 60

4.5 Failure of Electronic Systems ............................. 62

4.5.1 Calculation Principles ............................ 62

4.5.2 Network Modeling—Serial and Parallel Systems ....... 63

4.6 Reliability Analysis of Electronic Systems ................... 64

4.6.1 Preliminaries ................................... 64

4.6.2 Availability of Repairable Systems .................. 65

4.6.3 Electronic Systems Without Redundancy—Serial

Systems....................................... 66

4.6.4 Electronic Systems With Redundancy—Parallel

Systems....................................... 68

4.6.5 Service and Maintenance of Electronic Systems ........ 71

4.7 Recommendations for Improving Reliability of Electronic

Systems ............................................. 72

References................................................ 73

5 Thermal Management and Cooling ........................... 75

5.1 Introduction—Terminology, Temperatures, and Power

Dissipation ........................................... 76

5.1.1 Problem Definition .............................. 76

5.1.2 Important Parameters in Thermal Management ......... 79

5.1.3 Temperatures of Components and Systems ............ 82

5.1.4 Power Dissipation in Electronic Components .......... 83

5.2 Calculation Principles................................... 84

5.2.1 Electrical and Thermal Networks.................... 84

x Contents

5.2.2 Thermal Network Method ......................... 86

5.3 Heat Transfer ......................................... 90

5.3.1 Introduction .................................... 90

5.3.2 Conduction Heat Transfer ......................... 90

5.3.3 Convection Heat Transfer ......................... 93

5.3.4 Radiation Heat Transfer........................... 98

5.4 Methods to Increase Heat Transfer ......................... 107

5.4.1 Heat Sinks..................................... 107

5.4.2 Thermal Interface Materials........................ 110

5.4.3 Fans.......................................... 110

5.4.4 Heat Pipes..................................... 112

5.4.5 Peltier Elements................................. 113

5.5 Application Examples in Electronic Systems ................. 115

5.5.1 Component Temperatures ......................... 115

5.5.2 Outside and Inside Surface Temperatures of an

Enclosure...................................... 117

5.5.3 Choosing Open or Sealed Enclosures ................ 119

5.5.4 Heat Dissipation from Open Enclosures .............. 121

5.5.5 Heat Dissipation from Sealed Enclosures ............. 124

5.5.6 Heat Transfer Through Enclosure Panels.............. 130

5.5.7 Interior Air Temperatures ......................... 134

5.5.8 Heat Transfer Inside an Open Enclosure .............. 135

5.5.9 Heat Transfer Inside a Sealed Enclosure .............. 137

5.5.10 Forced Convection with Fans and Fan Selection........ 138

5.6 Recommendations for Thermal Management of Electronic

Systems ............................................. 145

References................................................ 146

6 Electromagnetic Compatibility (EMC)......................... 147

6.1 Introduction .......................................... 148

6.2 Coupling Between System Components ..................... 148

6.2.1 Conductive Coupling............................. 150

6.2.2 Capacitive Coupling ............................. 152

6.2.3 Inductive Coupling .............................. 154

6.2.4 Electromagnetic Coupling ......................... 156

6.3 Grounding Electronic Systems ............................ 157

6.3.1 Description of Reference Grounds................... 157

6.3.2 Reference Systems Schemes (Grounding Systems) ...... 159

6.3.3 Return Conductor to the Reference Point for Digital

Signals........................................ 162

6.3.4 Return Conductor to the Reference Point for Analog

Signals........................................ 163

6.3.5 Ground Loops .................................. 164

Contents xi

6.4 Shielding from Fields ................................... 165

6.4.1 Shielding Fundamentals........................... 165

6.4.2 Shielding Magnetostatic Fields ..................... 168

6.4.3 Shielding Magnetoquasistatic Fields ................. 170

6.4.4 Shielding Electrostatic Fields....................... 173

6.4.5 Shielding Electroquasistatic Fields................... 175

6.4.6 Shielding Electromagnetic Fields.................... 176

6.5 Electrostatic Discharge (ESD)............................. 181

6.5.1 Causes of ESD ................................. 181

6.5.2 ESD-Suppression Measures........................ 182

6.6 Recommendations for EMC-Compliant Systems Design ........ 183

6.6.1 Key Steps in System Development .................. 183

6.6.2 Designing Printed Circuit Boards and Shielding ........ 184

6.6.3 Designing System Cabinets........................ 188

6.6.4 Connecting Peripherals ........................... 190

References................................................ 191

7 Recycling Requirements and Design for Environmental

Compliance .............................................. 193

7.1 Introduction—Motivation and the Circular Economy ........... 194

7.2 Manufacture, Use, and Disposal of Electronic Systems in the

Circular Economy...................................... 197

7.3 Product Recycling in the Disposal Process................... 199

7.3.1 New Marketing Strategy—Selling Usage ............. 201

7.3.2 New Design Strategy—Product Durability ............ 201

7.4 Material Recycling in the Disposal Process .................. 203

7.5 Design and Development for Disassembly ................... 206

7.5.1 Structural Correctness ............................ 206

7.5.2 Design for Disassembly........................... 208

7.5.3 Ease of Opening ................................ 209

7.6 Material Suitability in Design and Development............... 209

7.6.1 Suitability of Quantities........................... 210

7.6.2 Suitability for Separation.......................... 210

7.6.3 Suitability for Recovery........................... 211

7.6.4 Material Compatibility............................ 213

7.6.5 Suitability for Disposal ........................... 213

7.6.6 Material Labeling ............................... 215

7.7 Recommendations for Environmentally Compliant Systems ...... 215

References................................................ 217

8 Appendix ................................................ 219

8.1 Notes and Rules on Technical Drawings .................... 219

8.1.1 Title Block .................................... 219

8.1.2 Scales ........................................ 220

xii Contents

8.1.3 Identification Number ............................ 220

8.1.4 Paper Sizes .................................... 221

8.1.5 Line Styles and Widths ........................... 221

8.1.6 Sectional Views................................. 222

8.2 Geometric Dimensioning and Tolerancing ................... 224

8.2.1 Elements of Specified Dimensions................... 224

8.2.2 Dimension Types................................ 225

8.2.3 Tolerance Terminology ........................... 225

8.2.4 Engineering Tolerances ........................... 226

8.2.5 General Tolerances .............................. 226

8.2.6 ISO Tolerances ................................. 227

8.2.7 Form and Positional Tolerances..................... 227

8.2.8 Surface Specifications ............................ 227

8.2.9 Material Specifications ........................... 228

8.3 Preferred Numbers—Renard and E-Series ................... 228

8.4 Schematic Symbols of Electronic Components................ 231

8.5 Labeling of Electronic Components ........................ 234

8.5.1 Labeling with Colors............................. 234

8.5.2 Labeling with Characters.......................... 235

Index ...................................................... 237

Contents xiii

Chapter 1

Introduction

Electronic systems design is the subject within electrical engineering that deals

with the multidisciplinary design issues of complex electronic devices, such as

smartphones and computers. The subject covers a broad spectrum, from the

development of an electronic system to assuring its proper function, service life,

and disposal. Major advances in technology, the increasing multidisciplinary nature

of the development process and the use of electronic devices in all aspects of our

daily lives pose immense challenges for every design engineer.

The book covers all aspects of the development of electronic systems by pre￾senting the theoretical knowledge required for their design and fabrication. This is a

discipline that spans electronics, physics, mechanics, and other topics. Designers of

electronic circuits, on the one hand, often lack the necessary manufacturing and

overall system’s expertise, while, on the other hand, (electro-) mechanical designers

are hindered in their work by their lack of knowledge of electronic components.

This is where this book comes in; it aims to marry the various disciplines involved.

The goal is to convey the knowledge and skills necessary for designing and

developing electronic systems and an understanding of the myriad engineering

approaches and tasks involved. The reader should learn from the book how to work

as a designer and fabricator of these products and acquire the necessary knowledge

of all relevant aspects. The key issues encountered in the development of electronic

systems are pictured in Fig. 1.1 along with references to the respective chapters in

the book.

The principle topics covered are the design process, packaging issues, and

associated system levels, extended with special requirements for the development

and fabrication of an electronic system. These requirements include protection

issues, reliability, thermal management and cooling, shielding, and recyclability.

The layout of the book is detailed below:

Chapter 2, Design Process and its Fundamentals, presents the steps involved in

the design process for electronic systems as well as the use of technical design

documentation, such as technical drawings and circuit diagrams. It also provides an

introduction to computer-aided design (CAD).

© Springer International Publishing AG 2017

J. Lienig and H. Bruemmer, Fundamentals of Electronic Systems Design,

DOI 10.1007/978-3-319-55840-0_1

1

Different packaging methods for the system-level and for individual components

as well as system protection are described in Chap. 3, System Architecture and

Protection Requirements. Particular emphasis is put on protection classes and IP

codes which stipulate how a system should be designed with the protection of

persons and the device interior in mind.

Critical reliability parameters and their use are introduced in Chap. 4, Reliability

Analysis. The reliability requirements for system-level and package design can thus

be met and the overall reliability of a system calculated from the known reliabilities

of individual components.

Losses and heat transfers associated with components and the overall system are

covered in Chap. 5, Thermal Management and Cooling. Thermal characteristics

can be determined at the design stage and suitable elements selected and deployed

for heat dissipation and meeting thermal criteria.

Chapter 6 in the book, Electromagnetic Compatibility, deals with EMC issues

when designing electronic systems. It also covers conceptual solutions comprising

shielding and protection measures against electrostatic discharge (ESD).

Chapter 7, Recycling Requirements and Design for Environmental Compliance,

presents material that may be new for many engineers and will certainly increase in

importance as industry continues to evolve. The chapter describes critical environ￾mental considerations during the design and development stages that have tremen￾dous impact later in the product life cycle, in particular at the tail end during product

Design Process

(Chapter 2)

System Definition

Preparatory Study Functional Specification

Circuit Design

System Protection

(Chapter 3)

Reliability

(Chapter 4)

Heat Dissipation

(Chapter 5)

System Architecture

and Packaging Issues

(Chapter 3)

Discrete Components

Integrated Circuits

Multi-chip Modules

Printed Circuit Boards

Power Supply

Enclosure

External Interconnects

Electromagnetic

Compatibility (EMC)

(Chapter 6)

Recycling

Requirements

(Chapter 7)

Technical

Drawings,

Circuit Diagrams,

CAD

(Chapter 2)

Fig. 1.1 Requirements for the development of an electronic system and the matching book

structure

2 1 Introduction